Advanced Packaging Pathfinding & Development - Thermal Engineer, (Principal / Senior Principal)

About Marvell

Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.

Your Team, Your Impact

What You Can Expect

We are seeking a Principal or Senior Principal Thermal Engineer to lead thermal pathfinding and development for advanced packaging technologies targeting datacenter applications. The successful candidate will define thermal architectures, influence Marvell and industry roadmaps, and deliver validated solutions spanning silicon package to system and rack level integration.

Key Responsibilities:

• Architect and develop thermal solutions for advanced silicon packages targeting datacenter environments, from concept through validation.

• Hands on characterization of thermal test vehicles and cooling solutions.

• Define and execute thermal design, materials, and process development at component and system levels.

• Partner with external ecosystem stakeholders (vendors, substrate suppliers, OSATs, foundries) to define and align thermal technology roadmaps.

• Explore and assess nextgeneration cooling technologies beyond current industry offerings; make recommendations and generate protected IP.

• Drive technology feasibility studies and deliver proofofconcept demonstrations.

• Collaborate crossfunctionally with IP, silicon design, package design, manufacturing, reliability, and test teams.

What We're Looking For

• Demonstrated experience in advanced packaging technologies with deep expertise in heat transfer, fluid dynamics, materials science, package assembly and reliability.

• Proven experience delivering thermal solutions at both component and system levels. Experience in advanced thermal solutions such as on-package and in-package liquid cooling and immersion cooling is desirable.

• Experience managing and influencing vendors, substrate manufacturers, OSATs, and foundries.

• Education & Experience:

  • Bachelor's degree with 15+ years relevant experience, or Master's degree with 12+ years relevant experience, or PhD (or postdoc) with 8+ years relevant experience
    (Mechanical/Thermal Engineering, Electrical Engineering, Materials Science, or related field)

Core Technical Skills

• Thermal Modeling & CAD Tools: Icepak, Flotherm, Celsius; SolidWorks, Creo

• Fundamental Expertise: Heat transfer, fluid dynamics, materials science, process

• Cooling Technologies:

  • Active and passive cooling solutions

  • Integration at component, system, and rack levels

• SystemLevel Thermal Integration:

  • Package heat sink board server chassis rack

  • Thermal management for scaleup and scaleout architectures

• Advanced Packaging Experience:

  • 2.5D / 3D technologies including: CoWoSS / R / L; EMIB; CPO; CPC

• Thermal Characterization & Validation:

  • Thermal test vehicles (TVs)

  • DAQ systems, calibration curves, LabVIEW

  • Thermocouples, airflow characterization, thermal chambers

• Reliability & Failure Analysis:

  • Chippackage interactions

  • Component and boardlevel failure mechanisms

Leadership & Collaboration Skills

• Ability to lead crossfunctional, multisite programs across global time zones.

• Strong interpersonal skills with a demonstrated ability to influence vendor roadmaps.

• Excellent communication, presentation, and technical documentation skills.

• Curiosity, adaptability, and willingness to learn emerging technologies.

Preferred Qualifications

• Broad understanding of package, interposer, silicon, substrate, and PCB design.

• Working knowledge of signal integrity and power integrity.

• Prior experience developing packaging solutions for the datacenter market.

Expected Base Pay Range (USD)

The successful candidate's starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.

Additional Compensation and Benefit Elements

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.

Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at TAOps@marvell.com.

Interview Integrity

To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.

These tools must not be used to record, assist with, or enhance responses in any way. Our interviews are designed to evaluate your individual experience, thought process, and communication skills in real time. Use of AI tools without prior instruction from the interviewer will result in disqualification from the hiring process.

This position may require access to technology and/or software subject to U.S. export control laws and regulations, including the Export Administration Regulations (EAR). As such, applicants must be eligible to access export-controlled information as defined under applicable law. Marvell may be required to obtain export licensing approval from the U.S. Department of Commerce and/or the U.S. Department of State. Except for U.S. citizens, lawful permanent residents, or protected individuals as defined by 8 U.S.C. 1324b(a)(3), all applicants may be subject to an export license review process prior to employment.