Senior Staff Package Engineer

About Marvell

Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, our innovative technology is enabling new possibilities.

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.

Your Team, Your Impact

What You Can Expect

• Understand the end product and/or end client requirements and define the optimal package solution for a given semiconductor product. Collaborating closely with cross functional teams - BU, CE, QA, and Product engineering, define and provide package design inputs for manufacturability, supply, performance, cost, quality, and reliability.
  * Perform package design review.
  * Manage and drive OSAT and substrate suppliers on risk assessment, design review and release, BOM and process, package char. and qual.
  * Provide inputs to design guidelines and drive to implement the guidelines.
  * Achieve milestone dates for all NPI schedules.
  * Work with QA, OSAT/substrate suppliers to resolve package related quality/reliability issues.
  * Work with procurement and suppliers on package cost analysis.
  * Provide inputs to the package technology roadmap. Support new package and technology development.
  * Manage and mentor junior engineers if required.

What We're Looking For

• Bachelor's degree in Mechanical Engineering or related fields and 5-10 years of related professional experience.
• Master's degree and/or PhD in Mechanical Engineering or related fields with 3-5 years of experience.
• Experienced with flip-chip package development and substrate review. Experience with large (>60mm) FCPBGA packages is a plus.
• Basic Cadence APD and AutoCAD skills
• Deep understanding of semiconductor technologies, 1st-level assembly processes, semiconductor packaging materials, reliability standards and failure analysis techniques. The ideal candidate would be knowledgeable of 2D, 2.5D, 3D and wafer-level packaging.
• Effective communication skills that can enable the candidate to collaborate well with internal cross functional teams and suppliers.
• Good program management skills. OSAT management experience is a plus.
• People management experience is a plus.
• Ability to work independently, provide leadership and to exercise discretion to solve complex problems.
• Automotive IC package experience and an understanding of AEC Q100 is preferred.

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Expected Base Pay Range (USD)

The successful candidate's starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.

Additional Compensation and Benefit Elements

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.

Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at TAOps@marvell.com.